引线键合的低成本分析(中文1700字+外文原文768字)
Equipment for Electronic Products ManufacturingEPE（总第160期）May.2008引线键合的低成本解决方案Jong-Soo Cho,Jeong-Tak,Moon(R&D,MK Electron Co.,Ltd.Korea,449-812)摘要:最近,金价不断上涨突破了35.4美元/g,同时半导体产品特别是存储器类产品的价格却不断下降。目前半导体行业最大的挑战是如何控制并降低成本。为了降低引线键合的原材料成本,近年来金-银合金引线已被开始用来替代金线键合。但是,由于金-银合金引线键合的器件在测试中出现的故障,不能用于在高湿度环境下进行可靠性测试(例如PCT测试)的器件,使其在应用上受到限制。研究了传统Au-Ag合金引线键合的电子器件在PCT测试时所产生的故障机理和钯元素的作用,通过在Au-Ag合金引线中掺入(Pd)钯元素来阻止在高湿度环境下进行可靠性测试时出现的故障。关键词:Au-Ag合金引线;PCT(高压炉测试);潮湿度;可靠性
Low Cost Solution for Bonding Wire
Jong-Soo Cho,Jeong-Tak,Moon(R&D,MK Electron Co.,Ltd.Korea,449-812)Abstract:Recently,gold price is going up to over 1,000USD and the price of semiconductor device thatis especially memory device is going down.In semiconductor industry,major concern is cost reduction.To reduce material cost of bonding wire,Au-Ag alloy wire has been tried to be used in electronic de-vices in substitution for Au wire,since several years ago.However,Au-Ag alloy wire could not been ap-plied to such devices due to failures during high humidity reliability test such as PCT(Pressure cookertest).This study investigates failure mechanism during PCT in electronic device of conventional Au-Agwire,the effects of the element(Pd)that was put into Au-Ag wire to prevent the humidity reliability test(PCT)failure.Keywords:Au-Ag wire;PCT |
