The Design Of Multi-Position Transfer Die For Transistor Lead Frame
Abstract:The graduation design is on global analysis of the manufacturing process of transfer die for transistor lead frame,and on the basis of the analysis we can work out a kind of die which can produce proper products.The major processes of the transfer die are piercing,blanking and so on.The design of the die mainly including layout design,the design and calculation of blade sizes of the punch and matrix,stamping force calculation and the determination of the pressure center,the design calculation of non-standard parts,the selection and the cerification of press machine.
Key words:process;transfer die;punching;blanking;punch;matrix;blade;design and calculation